WIMA SMD-PEN

Metallized Polyethylene-Naphthalate (PEN) SMD Film Capacitors with Box Encapsulation.

Capacitances from 0.01 µF to 1.0 µF.
Rated Voltages from 63 VDC to 400 VDC.
Size Codes from 1812 to 2824.

Special Features

Size codes 1812, 2220 and 2824 with PEN and encapsulated
Operating temperature up to 125°C
Self-healing
Suitable for lead-free soldering
According to RoHS 2015/863/EU

Typical Applications
For general DC-applications e.g.

By-pass
Blocking
Coupling and decoupling
Timing

Construction

Dielectric: Polyethylene-Naphthalate (PEN) film.
Capacitor electrodes: Vacuum-deposited
Encapsulation: Solvent-resistant, flame-retardent plastic case, UL 94 V-0
Terminations: Tinned plates
Marking: Colour: Black.

Internal construction:

Construction WIMA SMD capacitors

Electrical Data
Capacitance range: 0.01 µF to 1.0 µF
Rated voltages: 63VDC, 100VDC, 250VDC, 400VDC
Capacitance tolerances: ±20%, ±10%, (±5% available subject to special enquiry).
Operating temperature range: -55°C to +125°C
Climatic test category: 55/125/21 according to IEC
Test voltage: 1.6 Ur, 2 sec
Voltage derating: A voltage derating factor of 1.25% per K must be applied from +100°C for DC voltages and from +90°C for AC voltages.
Reliability: Operational life > 300000 hours. Failure rate < 2 fit (0.5 x Ur and 40°C)
Insulation resistance at +20°C: Measuring time: 1 min.
Ur Utest C < 0.33 µF 0.33 µF< C < 1.0 µF
63 VDC
100 VDC 50 V
100 V >3.75 x 103 MΩ > 1250 sec (MΩ x µF)
>250 VDC 100 V >1 x 104 MΩ > 3000 sec (MΩ x µF)
Dissipation factors at +20°C: tan δ
at f C < 0.1 µF 0.1 µF< C < 1.0 µF
1 kHz
10 kHz
100 kHz < 8 x10-3
< 15 x10-3
< 30 x10-3 < 8 x10-3
< 15 x10-3
–
Maximum pulse rise time:
Capacitance
µF max. pulse rise time V/µsec
63VDC 100VDC 250VDC 400VDC
0.01…0.022
0.033…0.068
0.1…0.22
0.33…0.68
1.0 30
20
10
8
3.5 35
200
10
6
4 40
40
12
–
– 35
21
–
–
–
Dip Solder Test/Processing
Resistance to soldering heat: Test Tb in accordance with DIN IEC 60068-2-58/DIN EN 60384-23. Soldering bath temperature max. 260°C. Soldering duration max. 5sec. Change in capacitance ΔC/C<5%.
Soldering process: Re-flow soldering.
Packing
Available taped and reeled in 12mm blister pack.