WIMA SMD-PPS

Metallized Polyphenylene-Sulphide (PPS) SMD Film Capacitors with Box Encapsulation.

Capacitances from 0.01 µF to 2.2 µF.
Rated Voltages from 63 VDC to 1000 VDC.
Size Codes from 1812 to 6054.

Special Features

Size codes 1812, 2220, 2824, 4030, 5040 and 6054 with PPS and encapsulated
Operating temperature up to 140°C
Self-healing
Suitable for lead-free soldering
Low dissipation factor
Low dielectric absorption
Very constant capacitance value versus temperature
According to RoHS 2015/863/EU

Typical Applications
For general applications in high temperature circuits e.g.

By-pass
Blocking
Coupling and decoupling
Timing
Filtering
Oscillating circuits

Construction

Dielectric: Polyphenylene-sulphide (PPS) film.
Capacitor electrodes: Vacuum-deposited
Encapsulation: Solvent-resistant, flame-retardant plastic case, UL 94 V-0
Terminations: Tinned plates
Marking: Colour: Black.

Internal construction:

Construction WIMA SMD capacitors

Electrical Data
Capacitance range: 0.01 µF to 2.2 µF
Rated voltages: 63VDC, 100VDC, 250VDC, 400VDC, 630VDC, 1000VDC
Capacitance tolerances: ±20%, ±10% (±5% available subject to special enquiry)
Operating temperature range: -55°C to +140°C
Climatic test category: 55/140/56 in accordance with IEC
Test voltage: 1.6 Ur, 2 sec
Voltage derating: For DC and AC voltages a voltage derating factor of 1% per K must be applied from +100°C and of 2% per K from +125°C
Reliability: Operational life > 300000 hours. Failure rate < 2 fit (0.5 x Ur and 40°C)
Insulation resistance at +20°C: Measuring time: 1 min.
Ur Utest C < 0.33 µF 0.33 µF< C < 2.2 µF
63 VDC
100 VDC 50 V
100 V >1 x 104 MΩ > 3000 sec (MΩ x µF)
>250 VDC 100 V >3 x 104 MΩ > 6000 sec (MΩ x µF)
Dissipation factors at +20°C: tan δ
at f C < 0.1 µF 0.1 µF < C< 1.0 µF C > 1.0 µF
1kHz
10kHz
100kHz < 15 x 10-4
< 25 x 10-4
< 50 x 10-4 < 20 x 10-4
< 25 x 10-4
– < 20 x 10-4
–
–
Maximum pulse rise time:
Capacitance
µF max. pulse rise time V/µsec
63VDC 100VDC 250VDC 400VDC 630VDC 1000VDC
0.01 …0.022
0.033…0.068
0.1…0.22
0.33…0.68
1.0…2.2 25
15
10
5
3 25
15
10
5
3 30
20
12
6
– 35
25
15
8
– 40
28
–
–
– 45
32
–
–
–
Dip Solder Test/Processing
Resistance to soldering heat: Test Tb in accordance with DIN IEC 60068-2-58/DIN EN 60384-20. Soldering bath temperature max. 260°C. Soldering duration max. 5sec. Change in capacitance ΔC/C<5%.
Soldering process: Re-flow soldering.
Packing
Available taped and reeled in 12mm blister pack.